Solutions for the Electronic Semiconductor Industry

The electronic semiconductor industry has extremely high requirements for material cutting accuracy and surface cleanliness. Traditional cutting methods are prone to producing burrs and large heat affected zones, which affect the performance of semiconductor components.

The water guided laser precision cutting equipment is designed specifically for this industry, using a 60-400W pulse laser to guide laser energy through a high-pressure water jet with a diameter of 0.05mm-0.1mm (pressure up to 100-200MPa), achieving high-precision cutting of semiconductor materials such as silicon wafers, sapphire substrates, and ceramic substrates. The cutting accuracy of the equipment can reach ± 4 μ m, the cutting edge roughness Ra is ≤ 0.2 μ m, and the heat affected zone is less than 10 μ m, effectively avoiding material performance degradation caused by high temperature during the cutting process.

In response to the cutting requirements of irregular holes on the substrate during the semiconductor chip packaging process, the equipment is equipped with CAD graphic import function, which can quickly generate cutting paths and achieve automated cutting of complex graphics. The cutting speed can be finely adjusted according to the material characteristics. In addition, the equipment adopts a closed working chamber and is equipped with a negative pressure dust removal system, which can effectively collect the dust generated during the cutting process, avoid contaminating semiconductor materials, and ensure product yield. At the same time, the equipment supports 24-hour continuous operation with a failure rate of less than 0.5%, meeting the large-scale and high-precision production needs of the electronic semiconductor industry and helping enterprises improve chip production efficiency by more than 25%.